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Chip level manufacturing process

Chip Level Manufacturing Process

  • FlexTouch uses well-established semiconductor process for consistent manufacturing.
  • Full traceability of each sensor.
  • Full traceability of every manufacturing step.

Additive Copper Plating Process

  • Excellent line width uniformity.
  • Saves material.
  • Environmentally friendly process.
Additive Copper Plating Process
Comprehensive testing

Comprehensive Testing

  • FlexTouch sensors are 100% tested at the factory.
  • Proprietary, custom-built and automated equipment to test every trace (including double-routing) and every electrode of every sensor before shipment.
  • Testing include: Open/Short, Partial defect, Uniformity, Visual / Cosmetic.

Roll-to-toll Double Sides Process

  • Efficient roll-to-roll manufacturing process that ensures high yield and lower cost
  • Additive process that lowers cost and enables narrower line width
Roll-to-toll double sides Process
Address(China): #908 East Huanhe Rd., Wuzhen, Jiaxing, Zhejiang
Address(ShenZhen): 719, Block C, China Resources Land Tower, Nanshan District, Shenzhen
Address(Taipei):5F, No. 663, Bannan Road., Chungho Dist., New Taipei City
Address(USA): 160 E. Tasman Dr. , San Jose, CA 95134, USA
Address(Korea): #2908,U-Tower,120,Heungdeokjungang-ro,Giheung-gu,Yongin-si,Gyeonggi-do,FlexTouch
Email：info@flextouch.cn
Tel: 0573-88722828
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