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Chip Level Manufacturing Process
- FlexTouch uses well-established semiconductor process for consistent manufacturing.
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Full traceability of each sensor.
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Full traceability of every manufacturing step.
Additive Copper Plating Process
- Excellent line width uniformity.
- Saves material.
- Environmentally friendly process.
Comprehensive Testing
- FlexTouch sensors are 100% tested at the factory.
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Proprietary, custom-built and automated equipment to test every trace (including double-routing) and every electrode of every sensor before shipment.
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Testing include: Open/Short, Partial defect, Uniformity, Visual / Cosmetic.
Roll-to-toll Double Sides Process
- Efficient roll-to-roll manufacturing process that ensures high yield and lower cost
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Additive process that lowers cost and enables narrower line width
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